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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays 1/ 17 tsz02201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? ? constant current led driver with 64 dimming steps for up to 4 leds b d1754hfn general description BD1754HFN is a multi - level brightness control led driver that works as a constant current driver with 64 steps, so that the driving current can be adjusted finely. BD1754HFN is best suited to turn on leds that require high - accuracy led brightness control. features ? current r egulation for up to 4 p arallel leds ? adjustable c onstant c urrent with 64 s teps ? high a ccuracy and g ood m atching of each c urrent c hannel (0 .5% typ) ? brightness c ontrol v ia s ingle - l ine d igital c ontrol i nterface (uni - port interface control = upic) applications this driver can be used in various application s such as mobile phones, portable game consoles and etc. typical application circuit key specification ? operating power supply voltage range : 2.7v to 5.5v ? quiescent current: 0.1a (typ) ? operating temperature range: - 30c to +85 c package w(typ) x d(typ) x h(max) BD1754HFN in iset gnd en l4 l3 l2 l1 power supply 0.1 f 120k (when i led - max =32ma) c in r iset hson8 2.90mm x 3.00mm x 0.60mm datashee t datashee t
2 / 17 BD1754HFN data s heet tsz 0 2201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 absolute maximum ratings (ta = 25c ) parameter symbol rating unit maximum applied voltage v max 7 v power dissipation pd 0.63 (note 1) w operating temperature range topr - 30 to +85 c storage temperature range tstg - 55 to +150 c (note 1) when mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm). derate by 5.04 mw/c for ta higher than 25 c. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins o r an open circuit between pins. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta = - 30 c to +85 c ) parameter symbol rating unit conditions min typ max operating power supply voltage v in 2.7 3.6 5.5 v driver pin voltage range v dr v 0.2 - v in - 1.4 v when current driver power on. electrical characteristics (unless otherwise specified, ta = 25 c and v in = 3.6v) parameter symbol limit unit conditions min typ max quiescent current i q - 0.1 1 $ v en =0v circuit current i dd - 1.2 2.0 ma except led current [current driver] maximum current i led - max 29.76 32.0 34.24 ma r iset n led current accuracy iled - diff - - 7.0 % when current 16.5 ma setting r iset n led current matching iled - mat ch - 0.5 3.0 (note 1) % when current 16.5 ma setting r iset n [logic controller] low threshold voltage v il - - 0.4 v high threshold voltage v ih 1.4 - - v +?/hyho,qsxw&xuuhqw i ih - 0 2 $ v en =v in /?/hyho,qsxw&xuuhqw i il - 2 0 - $ v en =0v (1+?7lph t hi 0.05 - 100 vhf (1/?7lph t lo 0.3 - 100 vhf en off time - out t off 1 - - msec in supply - > en active time t vinon 1 - - msec en stand - by - > vbat off time t vinoff 0 - - msec ( note 1) the following formula is used for calculation: i led - match = {(i max - i min ) / (i max + i min )} x 100 i max = the maximum current value from all channels i min = the minimum current value from all channels
3 / 17 BD1754HFN data s heet tsz 0 2201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 pin description no. pin name in/ out esd diode functions for power for gnd 1 en in in g nd led enable and brightness control signal 2 gnd - in - ground 3 iset out in gnd bias current 4 in - - gnd power supply voltage input 5 l1 out - gnd current sink for led 1 6 l2 out - gnd current sink for led 2 7 l3 out - gnd current sink for led 3 8 l4 out - gnd current sink for led 4 - thermal pad - - - heat radiation pad of back side connect to gnd block diagram in iset gnd current dac upic 6 en l2 l1 l4 l3
4 / 17 BD1754HFN data s heet tsz 0 2201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 typical performance curves fig ure 2. circuit curre nt vs operating power supply voltage operating power supply voltage: v in [v] ta= 25c ta= - 30c ta= 8 5 c circuit current: i dd [ma] fig ure 4. led output current vs led pin voltage (v in = 3.6 v, at 32 ma of led c urrent) ta= - 30, 25, 8 5 c l 1 te rminal voltage [v] i led (l 1 ) [ma] fig ure 1. circuit current vs operating power supply voltage (stand - by) operating power supply voltage: v in [v] i q [a] ta= - 30, 25, 8 5 c fig ure 3. led off - leakage current vs operating power supply voltage ta= - 30, 25, 8 5 c operating power supply voltage: v in [v] led off - leakage current [a]
5 / 17 BD1754HFN data s heet tsz 0 2201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 typical performance curves - continued fig ure 5. led output current vs operating power supply voltage (v in = 3.6 v, at 32 ma of led current) ta= - 30, 25, 8 5 c operating power supply voltage: v in [v] i led (l 1 ) [ma] fig ure 7. led current characteristics (v in = 3.6 v, integral linearity error) ta= - 30, 25, 8 5 c code [dec] fig ure 6. led c urrent characteristics (v in = 3.6 v, differential linearity error) ta= - 30, 25, 8 5 c code [dec] dnl (l 1 ) [lsb] inl (l 1 ) [lsb] fig ure 8. led current relative accuracy (v in = 3.6 v) ta= - 30c ta= 25c ta= 8 5 c current state l 1 - l 4 current ma tching (%)
6 / 17 BD1754HFN data s heet tsz 0 2201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 typical performance curves - continued fig ure 9. led current vs r iset (v in = 3.6 v, at the maximum current setting) ta= 25c r iset [ k ] i led (l 1 ) [ma]
7 / 17 BD1754HFN data s heet tsz 0 2201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 application information 1. description of operations (1) upic ( = uni - port interface control) interface BD1754HFN has a single - line digital control interface (upic) that can control the power on/off and led current value through the en pin. the led current decreases by one step depending on the number of rising edges. when the minimum output current is reached (64 rising edges), the next rising edge changes the output current to the pd[lpxpydoxhdwvwduwxswlph7rpdlqwdlqdq\rxwsxwfxuuhqwwkh(1slqpxvwehnhswdw+?ohyho7rsrzhu2)) the en pin must be kept dw/?ohyhoirupruhwkdqpvhf fig ure 10. brightness control method fig ure 11. upic interface by the following sequence, upic can control the current driver for max current and off state only. fig ure 12. upic interface usage for max current or off only max current max current en i led (internal) state c64 c64 t off off off off t off off off off max current max current en i led (inter nal) state c64 c63 c62 c61 c62 c60 c2 c1 c64 c63 t hi t lo t off off off min current off off en t hi t lo t off
8 / 17 BD1754HFN data s heet tsz 0 2201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 (2) current driver the max current is determined by the iset resistance and the following formula. the led current state can be changed by the en contr ol signal. when the state is c n , the output current (i led ) can be obtained from the following formula (where, n indicates a state number). the table below shows an example of the led current settings, when iset resistance is 120 >n @ r iset >n @ state output current [ma] state output current [ma] state output current [ma] state output current [ma] c64 32.0 c48 24.0 c32 16.0 c16 8.0 c63 31.5 c47 23.5 c31 15.5 c15 7.5 c62 31.0 c46 23.0 c30 15.0 c14 7.0 c61 30.5 c45 22.5 c 29 14.5 c13 6.5 c60 30.0 c44 22.0 c28 14.0 c12 6.0 c59 29.5 c43 21.5 c27 13.5 c11 5.5 c58 29.0 c42 21.0 c26 13.0 c10 5.0 c57 28.5 c41 20.5 c25 12.5 c9 4.5 c56 28.0 c40 20.0 c24 12.0 c8 4.0 c55 27.5 c39 19.5 c23 11.5 c7 3.5 c54 27.0 c38 19.0 c22 11.0 c6 3.0 c53 26.5 c37 18.5 c21 10.5 c5 2.5 c52 26.0 c36 18.0 c20 10.0 c4 2.0 c51 25.5 c35 17.5 c19 9.5 c3 1.5 c50 25.0 c34 17.0 c18 9.0 c2 1.0 c49 24.5 c33 16.5 c17 8.5 c1 0.5 when the state is c64 (the maximum value), the output current value can b e changed on the iset resistance value as below. state : c64 ,6(75hvlvwdqfh9doxhn output current per channel (ma) total output current of the four channels (ma) 240 16.0 64.0 120 32.0 128.0 90 42.7 170.8 60 64.0 256.0 ? ? 64 / max n i ma i led led ? ? ? ? ? ? ? ? ? ? ? ? ? k r mv ma i iset led / 600 4 . 6 max
9 / 17 BD1754HFN data s heet tsz 0 2201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 2. applic ation circuit example s (1) circuit example when the power supply is separated fig ure 13 . circuit example when the power supply is s eparated this figure shows a circuit example when the power supply f or in and for leds is separated . apply a voltage of v f (threshold voltage value of a white led) or higher to the led. in this case, please note that when the led is powered on, the voltage value of l* pin (each pin of l1 to l4) must be v in - 1.4 v at the maximum. if a voltage of higher th an v in - 1.4 v is applied to l* pin, a desired current value cannot be obtained. also, please pay attention to the voltage application procedure at start - up . be sure to power the current driver on using the upic after apply ing power supply voltages to the in and the led - anode pins. if the current driver is powered on prior to applying power supply voltages to the led, a rush current occurs in the led. determine the resistance value with which the led current value is maximized and then connect such resistor b etween the iset and the gnd pins. the power on/off and the brightness of the leds are controlled through the en pin in accordance with the upic format. (2) circuit example when using only two leds fig ure 14. circuit example when us ing only two /('?v 7klviljxuhvkrzvdflufxlwh[dpsohzkhqqrqhri/dqg//('?vduhxvhg&rqqhfwerwkriwkhxqxvhg/dqg/ pins to the gnd pin. likewise, it is possible to make the l1 and/or the l2 pins unused, which allows the back lights to be u sed with the one or three led(s) turned on. in all cases, connect the unused l* pin to the gnd pin. determine the resistance value with which the led current value is maximized and then connect such resistor between the iset and the gnd pins. the power on/ 2))dqgwkheuljkwqhvvriwkh/('?vduhfrqwuroohgwkurxjkwkh(1slqlqdffrugdqfh with the upic format. in iset gnd current dac upic 6 en l4 l3 l2 l1 o n the assumption that v f is 3 v power supply2=5v 0.1 f 120k 120k (when i led - max =32ma) c in r iset l4 l3
10 / 17 BD1754HFN data s heet tsz 0 2201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 (3) circuit example when the en pin is powered on at all times fig ure 15. circuit example when the en pin is powered on at a ll times this figure shows a circuit example when the en pin is powered on at all times. to prevent a rush current from occurring in the driver, it is nec essary to apply voltage to the in pin and the leds prior to powering the current driver on. mount an rc filter between the in and the en pins to delay the en pin rising against the power - supply voltage rising. determine the resistance value with which the led current value is maximized and then connect such resistor between the iset and the gnd pins. (4) cir cuit example when performing a pwm brightness control fig ure 16. circuit example when performing a pwm brightness control this figure shows a circuit example when performing a pwm brightness control. through switching the ise t resistance value by the pwm input signal, the led current is outputted under a pwm mode. the en signal is controlled by an applied voltage level. in the circuit example shown above, the led current value is changed to 3.43 ma in 0 % of the pwm duty cycle , 17.72 ma in 50 % of that and 32 ma in 100 % of that. rs in iset gnd current dac upic 6 en l2 l1 0.1 f cs l4 l3 (when i led - max =32ma) 120k in iset gnd current dac upic 6 en l2 l1 0.1 f pwm 1m
11 / 17 BD1754HFN data s heet tsz 0 2201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 (5) circuit example when driving a large current with only one led powered on. fig ure 17. circuit example when driving a large current with only one led powered on. this fig ure shows a circuit example when driving a large current through all of four channels with only one led powered on. by shorting out all the led driver pins, in the example of using 120 k 5 iset , a current up to 128 ma (32 ma x 4) can be driven. in this example, the brightness can be adjusted in 64 gradations with 2 ma step (0.5 ma vwhsfkdqqho[fkdqqhov)rukljkhufxuuhqwydoxhvxvlqjn 5 iset allows a current up to 256 ma to be driven into one of the leds. the power on/off and the brightness of the leds are controlled through the en pin in accordance with the upic format. (6) circuit example when making the eight leds available by connecting the two BD1754HFN drivers fig ure 18. circuit example when making the eight leds available by connecting the two BD1754HFN drivers this figure shows a circuit example when making eight leds available by connecting two BD1754HFN drivers. by connecting the control signals to the en pins in parallel, the eight led channels can be controlled concurrently. this parallel connection scheme can increase the number of the led channels further as necessary (such as twelve, sixteen, or more). determine the resistance valu e with which the led current value is maximized and then connect such resistor between the iset and the gnd pins. the power on/off and the brightness of the leds are controlled through the en pin in accordance with the upic format. in iset gnd current dac upic 6 en l2 l1 0.1 f l4 l3 (when i led - max =32ma) 120k in iset gnd current dac upic 6 en l2 l1 0.1 f l4 l3 (when i led - max =32ma) 120k
12 / 17 BD1754HFN data s heet tsz 0 2201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 (7) circuit example when c onnecting the two leds to each of the channels in series fig ure 19. circuit example when connecting the two leds to each of the channels in series this figure shows a circuit example when making 8 (2 x 4) leds available by conn ecting two leds to each of the channels in series. in this example, when v f is set to approx. 3 v in order to ensure the voltage to l1 through l4 pins, it is necessary to apply a voltage of 6.2 v (3 v x 2 leds in series + 0.2 v of the minimum voltage value of the driver pin) or higher to the led anode pin as its power supply voltage. pay attention that the voltage should not exceed the 7.0 - v maximum rating of the l1 through l4 pins. determine the resistance value with which the led current value is maximize d and then connect such resistor between the iset and the gnd pins. the power on/off and the brightness of the leds are controlled through the en pin in accordance with the upic format. 3. selection of components externally connected symbol recom mended value recommended component manufacturer c in 0.1f grm188b31h104ka92b murata symbol recommended value recommended component manufacturer r iset n mcr10pzhzf1203 rohm 4. recommended pcb layout design pcb pattern to provide low imped ance for the wiring to the power supply line. also, provide a bypass capacitor if needed. fig ure 20. layout image of the application components (top view) fig ure 21. surface (top view) pad is used for i mproving the efficiency of ic heat radiation. solder pad to gnd pin. moreover, connect ground plane (gnd) of board using via as shown in the patterns of next page. the efficiency of heat radiation improves according to the area of ground plane (gnd) . connect c in input - bypass capacitor in close proximity between the in and gnd pins. connect the r iset resistor in close proximity to the iset pin. led_pwr en gnd in r iset c in in iset gnd current dac upic 6 en l4 l3 l2 l1 power supply2=6.2 v to 7v 0.1 f 120k l4 l 2 l1 l3 en iset in gnd en gnd c in r iset led_pwr in
13 / 17 BD1754HFN data s heet tsz 0 2201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 op erational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply a nd the ic ? s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital blo ck from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at th e reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this a bsolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnet ic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subje fwwkh,&wrvwuhvv$ozd\vglvfkdujhfdsdflwruvfrpsohwho\diwhuhdfksurfhvvruvwhs7kh,&?vsrzhuvxsso\ should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
14 / 17 BD1754HFN data s heet tsz 0 2201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 operational notes C n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s
15 / 17 BD1754HFN data s heet tsz 0 2201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 ordering information b d 1 7 5 4 h f n - t r part n umber package hfn : hson8 packaging and forming specification tr : embossed tape and reel marking diagram hson8 (top view) 754 part number marking lot number 1pin mark bd1
16 / 17 BD1754HFN data s heet tsz 0 2201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 physical dimension, tape and reel information package name h son8
17 / 17 BD1754HFN data s heet tsz 0 2201 - 0g3g0c200060 - 1 - 2 10.dec.2015 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 >? 15 >? 001 revision history date revision changes 09.nov.2012 001 new release 10.dec .2015 002 applied the rohm standard style and improved understandability.
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation depending on ambient temperatur e. when used in sealed area, c onfirm that it is the use in the range that does not exceed t he maximum junction temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circui ts, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number BD1754HFN package hson8 unit quantity 3000 minimum package quantity 3000 packing type taping constitution materials list inquiry rohs yes BD1754HFN - web page distribution inventory

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